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- Contact Person : Ms. Sang Merry
- Company Name : Shenzhen Yego Technology Co., Ltd.
- Tel : 86-755-2698802
- Fax : 86-755-2698802
- Address : Guangdong,Shenzhen,C1004, A12, Yuquan Road, Nanshan Dist, Shenzhen, China
- Country/Region : China
- Zip : 518052
Best Quality, Laird Thermal Silicon Pad Tflex 700 Series Gap Filler Material 23CM*23CM*2MM For Laptop, Desktop, Chip, etc
Product Detailed
Related Categories:Other Electronic Components
Related Product Searches:Best Quality, Laird Thermal Silicon Pad Tflex 700 Series Gap Filler Material 23CM*23CM*2MM For Laptop, Desktop, Chip, etc,High Quality Laird Thermal Silicon Pad,Laird Thermal Silicon Pad TFlex 700 Series
Best Quality, Laird Thermal Silicon Pad Tflex 700 Series Gap Filler Material 23CM*23CM*2MM:
Thermal Conductivity: 5.W/MK
Related Product Searches:Best Quality, Laird Thermal Silicon Pad Tflex 700 Series Gap Filler Material 23CM*23CM*2MM For Laptop, Desktop, Chip, etc,High Quality Laird Thermal Silicon Pad,Laird Thermal Silicon Pad TFlex 700 Series
Best Quality, Laird Thermal Silicon Pad Tflex 700 Series
Gap Filler Material 23CM*23CM*2MM
For Laptop, Desktop, Chip, etc
Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts.
Tflex™ 700’s unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance.
Tflex™ 700 is naturally tacky, and requires no additional adhesive coating to inhibit thermal performance. Tflex™ 700 is electrically insulating, stable from -45ºC thru 200ºC and meets UL 94V0 flame rating.
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